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Bond-1 SF Bonding Agent, Solvent-Free

Bond-1 SF Bonding Agent, Solvent-Free - Pentron - N03N
Bond-1 SF Bonding Agent, Solvent-Free
84.00 SR
Ex Tax: 84.00 SR
  • Type: One-Step (7th Gen)
  • Curing: Light-Cure
  • Packing: 2x Syringe 1ml

Delivery Before  20/07/2024 Sat

Key Features

  1. Solvent-Free Composition: Bond-1 SF is a self-etch, one-coat bonding agent that is completely free of solvents. This eliminates the need for air drying, which in turn helps to protect against sensitivity and ensures the stability and consistency of the adhesive by preventing evaporation.

  2. Efficient Application Process: The application of Bond-1 SF is straightforward and time-efficient. It involves three basic steps: even application, rubbing for 20 seconds, and light curing. This process achieves optimal bond strengths of up to 30.4 MPa.

  3. No Air Drying Required: The absence of a drying step not only saves chair time but also removes the uncertainty related to the degree of drying required, which can be a common source of error in technique-sensitive dental procedures.

  4. Self-Etching Capability: As a self-etch adhesive, Bond-1 SF saves time and reduces the risk of sensitivity that can be associated with separate acid etching steps.

  5. Versatility in Use: This bonding agent is suitable for direct composite restorations and is compatible with both light cure and dual cure materials. It is particularly effective with dual cure materials when the initial layer is light initiated.

  6. Unique Handling Properties: Bond-1 SF is formulated to enable an even spread, ensuring complete coverage of the tooth surface and optimal bonding results.

Product Benefits

  • Reduction in Sensitivity and Technique-Related Issues: By being solvent-free, it avoids problems like under- or over-drying, common in other adhesives, thus protecting against sensitivity.

  • Time-Saving: Elimination of air drying saves valuable chair time, making the procedure more efficient.

  • Convenience and Ease of Use: Its one-coat, self-etch formula makes it easy to use and reduces the total time needed for the procedure.

  • Strong and Reliable Bonding: Achieves high bond strengths, ensuring durability and effectiveness of the restorations.


  • Direct Composite Restorations: Ideal for bonding in procedures involving direct composite materials.
  • Repairs to Composite, Ceramic, and Metal Substrates: Suitable for various types of dental repair work.
  • Pit and Fissure Sealant: Can be used effectively as a sealant in preventive dentistry.
  • Compatibility with Dual Cure Materials: Works well with dual cure materials, especially when the initial layer is light cured.

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