Ambar Bond Universal, 1-Step, Self-Etch, Light-Cure

Clinical Overview

Ambar Bond Universal (APS) is a self‑etching, light‑curing universal adhesive by FGM designed for enamel, dentin, and various restorative substrates. Featuring enhanced MDP chemistry and APS technology, it delivers reliable adhesion even under moist conditions and supports all etching protocols—self‑etch, selective‑etch, or total‑etch. Compatible with composites, ceramics, metals, CAD/CAM materials, and intracanal posts.

Key Benefits

• Universal application modes: Works in self‑etch, selective‑etch on enamel, or total‑etch protocols per clinical preference.
• Enhanced MDP monomer: Offers strong chemical bonding to dentin and indirect substrates with improved adhesive film stability.
• APS Technology: Delivers consistent performance across varying dentin moisture levels, ideal for intracanal applications.
• Broad substrate compatibility: Adheres effectively to enamel, dentin, ceramics, metals, resin, CAD/CAM composites and posts.
• BPA‑free and colorless: Minimizes postoperative sensitivity and won’t alter restoration esthetics.

Kit Contents

• 1 × 5 mL bottle of Ambar Bond Universal APS adhesive
• Dispensing cap or micro‑applicator tip for controlled delivery

Working & Setting Times

• Application: Apply first drop by rubbing for 10 s, then reapply and rub for additional 10 s.
• Air‑thinning: Air‑blow for ~10 s to evaporate solvents and create a uniform film.
• Curing time: Light‑cure for ~10 s per tooth surface; extend to ~20 s for intracanal applications.

Indications

• Direct composite restorations (Class I–V)
• Adhesive cementation of crowns, veneers, inlays, onlays, and intracanal posts using resin cement
• Repairs of ceramics and composite surfaces
• Bonding to metals, ceramic, CAD/CAM resin, fiberglass posts, and other restorative substrates

Instructions for Use

1. If using selective-etch or total-etch mode, acid‑etch enamel (~30 s) and/or dentin (~15 s), rinse and maintain moist dentin. Otherwise proceed with self‑etch approach.
2. Using micro‑applicator, apply first adhesive layer with rubbing motion for 10 s; then apply second layer and rub for additional 10 s.
3. Air‑thin for approximately 10 s to remove solvent and form thin adhesive film.
4. Light‑cure adhesive for ~10 s per surface; in deep or intracanal sites, extend to ~20 s.
5. Proceed with composite placement, adhesive resin cementation, or repair protocol following standard bonding workflow.

Summary

Ambar Bond Universal APS is an all‑in‑one, self‑etch light‑cure adhesive designed for modern restorative workflows. Its APS technology ensures reliable performance under variable moisture, and enhanced MDP chemistry ensures high bond strength across substrates. Colorless, BPA‑free, and compatible with multiple etching modes, it offers streamlined versatility for both restorative and prosthetic bonding.